Remove 3D Remove Hardware Remove Intel
article thumbnail

Intel?s 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables

The Verge

Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intel’s best answer yet to ARM.

3D 85
article thumbnail

Some of macOS Monterey's best features won't work with Intel-based Macs

TechSpot

Apple is great at hyping its latest hardware and software. Live Text, Universal Control, and detailed 3D maps were played up as must-haves in macOS Monterey. Craig Federighi showed off this skill leading Apple's opening keynote address for WWDC 2021. However, there is a catch.

3D 122
Insiders

Sign Up for our Newsletter

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

article thumbnail

Intel leans hard on advanced chip packaging technologies in battle for computing supremacy

Venture Beast

Advanced packaging technologies allow Intel to mix and match transistors to optimize for performance, cost, and time to market. Read More.

Intel 145
article thumbnail

Intel thinks the metaverse will need a thousand-fold increase in computing capability

The Verge

Intel made its first statement on the metaverse on Tuesday — its first public acknowledgement of that sometimes-nebulous future of computing which promises an always connected virtual world that exists in parallel with our physical one. Of course, Intel also has a vested interest in saying that we need more and better computers and servers.

Intel 90
article thumbnail

Intel has a new architecture roadmap and a plan to retake its chipmaking crown in 2025

The Verge

Intel is rethinking how it releases — and brands — its semiconductor innovations, CEO Pat Gelsinger announced today at the company’s Intel Accelerated webcast. Intel rebrands its node naming. Image: Intel. Intel’s updated roadmap and node naming. Here’s a look at Intel’s new roadmap and what it all actually means.

Intel 88
article thumbnail

AMD / Nvidia / Intel CES 2023 Recap and Analysis: 3D V-Cache, "RTX 4090" for laptops, new affordable CPUs

TechSpot

This should be a good time for a CES 2023 news recap and analysis, with tons of PC hardware announcements as expected, and AMD having just concluded its presentation. So let's run through all the interesting stuff and give our thoughts on what's been shown.

article thumbnail

AMD stacks memory cache in 3D to boost datacenter CPUs

Venture Beast

Advanced Micro Devices is announcing it is shipping its third-generation AMD Epyc processors with AMD 3D V-Cache. Read More.

3D 84