3D Architecture Big Data 
CTOvision
DECEMBER 15, 2014
Big data is an evolving term that describes any voluminous amount of structured, semi-structured and unstructured data that has the potential to be mined for information. Although big data doesn’t refer to any specific quantity, the term is often used when speaking about petabytes and exabytes of data.
CTOvision
OCTOBER 22, 2014
About two years ago, we began investigating magnetic field architecture (MFA) and hover technology as a better way to build, move people and move materials,” said Arx Pax founder Greg Henderson. Cloudera , Red Hat make enterprise big data pact. IBM, Pentaho make the case for a big data refinery. Hey, McFly!
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CTOvision
APRIL 19, 2014
Modular design, open architecture. Integrated processing and management of current and historical enterprise data. iris, 2D and 3D facial information, etc.). Big Data - We cover the technologies that help organizations deal with massive quantities of data. Mapping Technologies. Real-time mapping.
All Things Distributed
NOVEMBER 15, 2010
From financial processing and traditional oil & gas exploration HPC applications to integrating complex 3D graphics into online and mobile applications, the applications of GPU processing appear to be limitless. These trade-offs have even impacted the way the lowest level building blocks in our computer architectures have been designed.
Storage IO Blog
JULY 31, 2015
3D XPoint is not NAND flash, it is also not NVRAM or DRAM, it’s a new class of NVM that can be used for server class main memory with persistency, or as persistent data storage among other uses (cell phones, automobiles, appliances and other electronics).
Storage IO Blog
JULY 31, 2015
In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g. In a webcast the other day, Intel and Micron announced new 3D XPoint non-volatile memory (NVM) that can be used for both primary main memory (e.g.
Storage IO Blog
JULY 31, 2015
The initial die or basic chip building block 3D XPoint implementation is a layer 128 Gbit device which if using 8 bits would yield 16GB raw. For example while a current die could hold up to 16 GBytes of data, multiple dies could be packaged together to create a 32GB, 64GB, 128GB etc. or larger actual product.
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